INVT 4th-Generation Modular Data Center Powers 3000P AI Computing Platform
Time of issue:2025-12-19
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Huafu Color Spinning is building an AIGC intelligent computing center to support large‑scale AI and digital applications.
The Huafu AIGC Intelligent Computing Center is designed with a total computing power of 3000P, built to a B+ level according to local data center grading requirements. To match rapidly increasing AI workloads and business digitalization, Huafu needed a high‑density, energy‑efficient AI data center that could be deployed quickly and operated reliably within the constraints of an existing factory site in Zhejiang, China.

Needs and Challenges
Before the new AI data center was built, Huafu faced several key challenges:
Urgent demand for digital transformation
Existing IT infrastructure had low digital efficiency and difficult, manual information processing, which constrained production management, data analysis, and AI application rollout.
Insufficient computing power for AI and AIGC
With the AI demand index increasing, traditional infrastructure could not provide enough computing power to support AIGC workloads, intelligent analytics, and future AI services.
Limited outdoor space at the factory
The factory site offered very limited outdoor area for installing traditional cooling systems and supporting infrastructure, making it difficult to expand a conventional data center.
Huafu needed a modular AI data center solution that would:
Greatly increase computing density,
Deliver low PUE and low operating costs, and Fit into a space‑constrained industrial site while meeting national low‑carbon and energy‑saving policies.
INVT Solution
To address these challenges, Huafu deployed an INVT iTalent series integrated data center solution, combined with INVT’s latest power and cooling technologies.
1. High‑density modular architecture
The Phase I construction adopts 6 sets of INVT 4th‑generation italent dual‑row modular data center solution with cold aisle containment systems.
Single‑cabinet power density: 15 kW, enabling high‑density AI computing within each rack.
A total of 158 server cabinets are deployed, providing strong, scalable computing and storage capacity for AI and AIGC workloads.
The modular layout allows capacity to be expanded in phases as computing demand grows.

2. Efficient, reliable power infrastructure
3 sets of new INVT 600/60D series modular UPS systems provide high‑efficiency, flexible power protection.
Maximum efficiency up to 97%, significantly reducing power conversion losses and improving overall energy efficiency.
Peak‑shaving and joint power supply functions help optimize power usage structure and reduce grid impact during peak hours.
Equipped with high‑power batteries capable of short‑time, high‑current discharge, ensuring the AI data center can safely withstand sudden load changes and short power disturbances.


3. Precision cooling with space‑saving design
Cooling uses 60 kW in‑row, high return‑air precision air conditioners, positioned close to the racks for targeted cooling of high‑density cabinets.
30 in‑row air conditioners (60 kW each) work in coordination with 3 room‑level precision air conditioners (30 kW each) to ensure both local hotspot control and overall room stability.
The system adopts centralized condensers/outdoor units,
Achieving a 15% reduction in floor space compared with dispersed outdoor units
Meeting the limited outdoor space constraints of the factory site.
The high return‑air temperature design improves chiller and system efficiency, contributing to a low overall PUE of < 1.3, in line with national low‑carbon and energy‑saving policy requirements.
4. Intelligent management and fast delivery
An intelligent management system centrally monitors power, cooling, cabinets, and environmental conditions, supporting visual operation, alarms, and data analysis.
The prefabricated, modular architecture of the iTalent integrated data center enables fast deployment, helping Huafu accelerate its AI infrastructure rollout while maintaining quality and reliability.
Customer Benefits
By adopting INVT’s integrated data center solution, Huafu’s AIGC intelligent computing center achieves:
Significantly enhanced computing power
3000P design computing power and 15 kW per rack support high‑density AI workloads and future AIGC growth.
The modular dual‑row cold aisle containment architecture allows computing capacity to expand smoothly as business needs increase.
High space efficiency in a constrained factory site
Centralized condensers and outdoor units reduce required floor space by around 15%, solving the challenge of limited outdoor area.
The compact, dual‑row layout maximizes IT capacity per square meter in the equipment room.
Low PUE and energy‑efficient operation
600/60D modular UPS (up to 97% efficiency), DC variable‑frequency technology, EC fans, and high return‑air precision cooling combine to deliver an overall PUE < 1.3.
This supports Huafu’s low‑carbon, energy‑saving goals and aligns with national green data center policies.
Stable, intelligent, and cost‑effective O&M
The intelligent management platform improves O&M efficiency, enabling proactive fault detection and data‑driven operations.
High‑power batteries and advanced UPS functions enhance power reliability, reducing downtime risk and lowering long‑term operating costs.
With INVT’s iTalent integrated data center, TengZhi dual‑row containment, 600/60D modular UPS, and high‑efficiency precision cooling, Huafu Color Spinning has built a B+‑level AIGC intelligent computing center that is high‑density, energy‑efficient, and scalable, providing a solid infrastructure foundation for its ongoing AI and digital transformation.
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